The total investment exceeding 5 billion yuan has led to the establishment of the Yao Hong Electronics AI Intelligent Computing High-Speed Motherboard Core Material R&D and Production Base project in Wuxi.

On July 31, the project for the AI intelligent computing high-speed motherboard core material R&D and production base was signed and established in Wuxi. The total investment in the project exceeds 5 billion yuan, primarily focusing on the production of high-end copper-clad laminates for AI servers, optical modules, high-end chips, and other fields. It will also involve building a R&D headquarters and key laboratories, with a focus on tackling cutting-edge technologies such as M10 high-speed copper-clad laminates. The project is expected to commence this year, and once it reaches full capacity, it will produce 30 million square meters of ultra-thin copper-clad laminates for AI high-speed packaging and 60 million meters of ultra-thin adhesive sheets annually.