Glass-based packaging becomes the new focus of industry competition as panel manufacturers diversify their strategies.

Recently, Zhao Jun, Senior Vice President of TCL Technology and CEO of TCL Huaxing, revealed during the ChinaJoy event in Shanghai that TCL Huaxing has formed a professional team to advance the verification of key processes for glass-based packaging. The plan is to showcase related samples in the second half of the year and establish a pilot production line. Additionally, BOE's 993 million yuan investment in the glass-based packaging substrate testing line has sent samples to domestic customers, some of whom have entered the technical testing stage through concept verification. Shentianma has also set up an MPG multi-project glass substrate technology platform, with advanced packaging as one of its key empowerment directions. As AI chips accelerate their evolution toward larger sizes, higher computing power, and high-density interconnection, traditional organic substrates are gradually reaching their performance limits. Advanced glass-based packaging is becoming the new focal point in the industry, leading to a cross-domain layout initiated by panel manufacturers.