Lates News

SK Hynix announced on the 4th that the company, in collaboration with SanDisk, has jointly released the first standard specification for the next-generation storage technology, High Bandwidth Flash (HBF). It is reported that this released standard is the first result of approximately six months of work following the initiation of HBF standardization cooperation between SK Hynix and SanDisk in August of last year and the establishment of a consortium in February of this year. The specification defines two capacity configurations that use 8-layer and 16-layer NAND chip stacking, with a maximum supported capacity of 512GB; it sets bandwidth standard data transfer capabilities across three grades (Grade 1-3), covering approximately 0.4TB/s to 3.0TB/s.