Tianfeng Securities: Development of AI servers boosts high-end copper foil domestic substitution.

Tianfeng Securities released a research report stating that the development of AI is driving demand for high-end PCB copper foils and product iteration, and domestic manufacturers are expected to share the industry's growth cake. The demand for HVLP copper foils in AI servers has surged, and NVIDIA's new generation Rubin platform explicitly adopts HVLP 5th generation copper foils matching PTFE substrates, promoting value and volume improvement. Domestic copper foil manufacturers have made breakthroughs in the field of high-end PCB copper foils, and domestic manufacturers are expected to benefit from this round of AI development, such as Tongguan Copper Foil, Defu Technology, and others.