Hengkun New Materials' IPO on the Science and Technology Innovation Board is approved by the listing committee, breaking the foreign monopoly on key materials for 12-inch integrated circuits.

According to the Securities Times App, on August 29th, Xiamen Hengkun New Materials Technology Co., Ltd. (referred to as Hengkun New Materials) passed the review of the Shanghai Stock Exchange's Sci-Tech Innovation Board listing committee. The sponsor of this IPO is Citic Securities, and it plans to raise 1.007 billion yuan.