The world's first high-speed communication chip developed by our scientists that can intelligently realize full-band communication.

According to the Science and Technology Daily, using advanced thin film lithium niobate photonic materials, based on a new architecture, Chinese scholars have developed the world's first adaptive, full-bandwidth, high-speed wireless communication chip based on optoelectronic fusion integration technology. On August 27th, this achievement was published in the top international academic journal "Nature". Experimental verification shows that the innovative system based on the chip can achieve an ultra-high wireless transmission rate of over 120Gbps, meeting the peak rate requirements of 6G communication, and the end-to-end wireless communication link performance is consistent across the full band, with no degradation in performance in the high frequency band. This clears obstacles for efficient development of 6G communication in the terahertz and even higher frequency spectrum resources.