"According to reports, Baidu is considering issuing dessert bonds again, adding more heat to the market that set a record for bond issuance size this year."

According to sources familiar with the matter, Baidu is considering issuing dim sum bonds again. Just a few months ago, the company had just priced the first batch of offshore RMB bonds of this kind. Sources stated that the potential issuance transaction may include a 3.5-year bond. They also mentioned that Baidu is considering raising approximately 4 billion RMB through bond issuance, with a final size not exceeding 4.5 billion RMB. As the information is not public, sources requested to remain anonymous. They also mentioned that the bond issuance plan has not been finalized, and the details may be adjusted based on investor feedback. Baidu's potential new bond issuance plan is expected to add heat to the dim sum bond market. Recently, such issuance transactions have been active, and the issuance size of credit dim sum bonds reached an eight-month high last month. Data shows that financing costs remaining low and the expected expansion of the southbound bond connect have driven enterprises to issue a record-breaking $43.8 billion in such bonds this year. A Baidu spokesperson did not respond to a request for comment via email.