CICC: Liquid cooling leads the new era of server heat dissipation.

The research report from Zhongjin Company states that with the continuous updates and application of AI large models, the demand for computing power is constantly increasing, and chip power consumption and computing power density are gradually rising. Liquid cooling technology, with its advantages of high heat dissipation efficiency and high deployment density, is accelerating the replacement of air cooling to become mainstream. It is estimated that by 2026, the global AI liquid cooling market will reach $8.6 billion. Liquid cooling technologies include cold plate, immersion, and spray cooling, among which cold plate liquid cooling is currently the most mature liquid cooling solution due to its minimal changes to equipment and data center infrastructure and significant cooling effects. Various sectors of the industry chain are actively laying out, with a vast market space. According to IDC predictions, the size of the liquid-cooled server market in China is expected to grow by 67% year-on-year in 2024.