Beijing Zhongguancun added three new chip common technology service platforms.

Recently, the Integrated Circuit Design Park in Zhongguancun, Beijing has launched three service platforms focusing on common technologies in the chip field: a high-speed signal testing laboratory, a high-end advanced packaging technology service center, and a power cycle and transient thermal testing laboratory. Among them, the high-speed signal testing laboratory focuses on providing high-speed signal testing services for scenarios such as satellite communication, automotive navigation positioning, and high-speed interconnection in data centers.