Shanghai Shengmei has made significant upgrades to its Ultra C wb wet cleaning equipment used in the field of advanced chip manufacturing.

Shengmei Shanghai announced today that it has made a significant upgrade to its Ultra C wb wet cleaning equipment. This new upgrade is aimed at meeting the demanding technical requirements of advanced node manufacturing processes. The upgraded Ultra C wb now incorporates the nitrogen bubbling technology in its patent application, effectively solving the issues of poor wet etching uniformity and secondary deposition of by-products. This technology has great potential applications in 3D NAND, 3D DRAM, and 3D logic devices with more than 500 layers.