Huafeng Technology: plans to raise up to 1 billion yuan through private placement, which will be used for the expansion of the high-speed line module production project and other purposes.

Huafeng Technology announced that the company plans to issue A-shares to specific parties, with the type of shares being domestic RMB ordinary shares with a face value of RMB 1.00 per share. The method and timing of the issuance will be implemented at an opportune time within the validity period after obtaining approval from the Shanghai Stock Exchange and the China Securities Regulatory Commission. The issuance is restricted to not more than 35 specific investors who meet the conditions stipulated by the CSRC and SSE. The total amount of funds raised shall not exceed RMB 1 billion, and the net proceeds after deducting relevant issuance costs will be used for the high-speed line module expansion project, defense connector base construction and capacity expansion project, communication connector R&D capability upgrade project, and supplementary working capital.