Copper Crown Copper Foil: HVLP Copper Foil has entered the supply chain of multiple leading CCL manufacturers, with full orders.

The announcement of the Copper Crown Copper Foil Investor Relations Activity Record form stated that HVLP copper foil, also known as ultra-low profile copper foil, has extremely low surface roughness, excellent signal transmission performance, low loss characteristics, and extremely high stability. It is a special core material for ultra-low loss high-frequency high-speed circuit boards, and can be widely used in the 5G communication and AI fields. Currently, the product has successfully entered the supply chain of many leading CCL manufacturers, with full orders. The company has the production capacity of 1-4 generations of HVLP copper foil, with 2nd generation products being the main product shipped at present.