Bank issued over 200 billion yuan in bonds for science and technology innovation.

On May 7th, the bond market's "technology board" officially set sail, and will soon reach its one-month mark. During this period, the scale of issuance of technology innovation bonds has continued to increase. Wind data shows that from May 7th to June 5th, a total of 202 science and technology innovation bonds have been issued, with a total issuance amount exceeding 388.3 billion yuan. From June 6th to June 10th, there are 6 more science and technology innovation bonds set to be launched. Financial institutions, private equity investment institutions, and venture capital institutions have actively issued science and technology innovation bonds. From the current situation of issuance, banking institutions have taken on the main role in issuance, with a total of 20 science and technology innovation bonds issued by 16 banks from May 7th to June 5th, with a total issuance amount of over 201 billion yuan, accounting for more than half of the total issuance amount; securities companies, private equity investment institutions and other non-banking financial institutions have a combined issuance amount of 32.4 billion yuan.