Raytheon Microelectronics denies rumors of collaboration with Huawei and SMIC.

According to online reports, there have been rumors recently that Raytheon Micropower is collaborating with Huawei to develop a 28GHz millimeter wave RF front-end module, and collaborating with SMIC to develop a 22nm FDSOI process PDK, and plans to enter the mass production stage this year for use in satellite communication and mobile phone chips. In response, Raytheon Micropower stated that the company is currently not collaborating with the two companies mentioned above.