Gaoce Corporation: 12-inch silicon-based semiconductor slicing machine sees a surge in orders, has received bulk orders from top clients.

On June 24th, Gaocel Technology stated on its interactive platform that with the increase in demand for large silicon wafers for semiconductors and the gradual implementation of expansion plans by substrate factories, the company's 12-inch silicon-based semiconductor wafer cutting machines have received a large number of orders and have already obtained bulk orders from top customers.