Xing Sen Technology (002436.SZ) plans to raise up to 3.9 billion yuan for high-end mSAP substrate intelligent manufacturing and industrialization projects.

Zhitong Finance and Economics APP News, Xingsen Technology (002436.SZ) disclosed its plan to issue A-shares to specific targets in 2026, raising a total amount of funds not exceeding 3.9 billion yuan (including). The net proceeds from the offering, after deducting related issuance expenses, are intended to be used in full for the high-end mSAP substrate intelligent manufacturing and industrialization project (Phase 1) of Zhuhai Xingsen Semiconductor Co., Ltd., the integrated circuit packaging substrate project (Phase 3) of Zhuhai Xingke Semiconductor Co., Ltd., supplementary working capital, and repayment of bank loans.