Sirui New Materials: Actively developing molybdenum copper materials to match the demand of the optical module market.

Srirui New Material stated on the interactive platform today that the company is actively developing molybdenum-copper materials to meet market demand, while also researching low-cost and mass-production copper-diamond preparation processes. This is to build up technological capabilities for the scaled application of optical modules with speeds exceeding 1.6T, supporting the development demands of downstream optical module products. The company is focusing on the high heat dissipation requirements of optical module casings with speeds of 1.6T and above, developing various copper alloy powders, 3D printing processes, and combining VC thermal technology to propose a "full-process + integrated" solution. This can achieve more flexible structural design and continue to advance verification with customers, further meeting the demands of high-end heat dissipation scenarios. By 2025, the company has already supplied small batches of high-strength, high thermal conductivity copper alloy casings in the direction of 800G and 1.6T to major customers.