Micro Company: Highly Values the Research and Development of Advanced Packaging Products

On May 13, at the performance briefing, Yin Zhiyao, Chairman and General Manager of Zhongwei Company, stated that the company attaches great importance to the research and development of advanced packaging products. Currently, core etching equipment such as CCP and TSV devices have been mass-produced and the company has also laid out equipment such as PVD, CVD, ECP, bonding, and quantity detection. It was reported that Zhongwei Company's etching products used in key etching processes continue to grow rapidly and currently cover various ultra-high aspect ratio requirements in storage etching applications.