Bomin Electronics: terminates external investment of 5 billion yuan.

Bomin Electronics announced that the company has decided to terminate the "Strategic Cooperation Agreement on Bomin IC Packaging Substrate Production Base Project" and "Investment Agreement" signed with the Hefei Economic Development Zone Management Committee, with a total investment of about 5 billion yuan for the Bomin ceramic substrate and IC packaging substrate production base project. As of the disclosure date of the announcement, the project has not carried out any substantial investment or construction activities, no related investment expenditure has occurred, and no debt disputes have arisen. The termination of this external investment and the cancellation of the wholly-owned subsidiary Hefei Borui Intelligence Chip Co., Ltd. will not have a significant adverse impact on the company's production, operation, and financial condition.