China Sky Deluxe: The joint venture company Kexin is currently making samples for some customers and the progress is smooth.

Zhongtian Fine Packaging announced on December 25th on its interactive platform that the company's affiliated enterprise, CoreSemi Semiconductor Technology Co., Ltd., focuses on the main business of FCBGA high-end packaging substrate. Their products are used for the packaging of high-performance chips such as TPU/CPU/GPU/AI chips, and the project is set to start production in September 2025. CoreSemi is currently in the process of making samples for some customers, and all aspects of the project are progressing smoothly.