TEIL Laser: The prototype of ultra-fast laser drilling equipment is under development.

On December 4th, Teir Laser announced on its interactive platform that the TGV equipment used in the semiconductor chip packaging and display chip packaging fields has completed the shipment of panel-level glass substrate pinhole equipment, achieving comprehensive coverage of wafer-level and panel-level TGV packaging laser technology. The ultrafast laser drilling technology used in the PCB industry is currently under research and development, continuously promoting the extension and application expansion of the technology. Currently, the prototype of ultrafast laser drilling equipment is in the trial production stage.