Zenbo Technology's Sci-Tech Innovation Board IPO "has been queried", with the company ranking first in the silicon and quartz components market.

date
16/07/2025
avatar
GMT Eight
On July 16, Chongqing Zhenbao Technology Co., Ltd. (referred to as Zhenbao Technology) applied for a change in the status of its listing review on the Shanghai Stock Exchange's Sci-Tech Innovation Board to "under inquiry". China Citic Securities is its sponsor institution, and it plans to raise 1.398 billion yuan.
On July 16th, Chongqing Zhenbao Technology Co., Ltd. (referred to as Zhenbao Technology) applied for a change in the status of its listing review on the Shanghai Stock Exchange's Sci-Tech innovation board to "under inquiry". CITIC SEC is its sponsor institution, and it plans to raise 1.398 billion yuan. According to the prospectus, Zhenbao Technology focuses on providing parts and surface treatment solutions for manufacturing equipment vacuum chambers for customers in the integrated circuit and display panel industries. The company's main products are equipment parts made of silicon, quartz, silicon carbide, and alumina ceramics, as well as surface treatment services such as thermal spraying regeneration, anodic oxidation, and precision cleaning. According to Frost & Sullivan data, in 2024 among domestic enterprises supplying semiconductor equipment parts to wafer fabs, the company ranks first in the silicon parts market with a revenue market share of 4.5%, and first in the quartz parts market with a revenue market share of 8.8%. The company's parts products and surface treatment services are mainly used in plasma etching, thin film deposition, and other processes in the semiconductor equipment and display panel industries. Zhenbao Technology has mass-produced large diameter single crystal silicon rods, polycrystalline silicon rods, high-purity silicon carbide thick materials deposited by chemical vapor deposition, ceramic granules, and other semiconductor materials, forming an integrated business platform of "raw materials + parts + surface treatment". The company continuously breaks through key semiconductor material preparation and surface treatment technologies, expands core parts product categories, and provides customers with comprehensive solutions for multiple types of parts inside manufacturing equipment vacuum chambers. The company's semiconductor equipment parts products have been widely used in logic class 14nm and below technology nodes in advanced process integrated circuit manufacturing, 200-layer and above stacked advanced process 3D NAND flash memory chip manufacturing in the storage sector, and 20nm and below technology nodes in advanced process DRAM storage chip manufacturing. The company has established stable business cooperation relationships with the top ten domestic integrated circuit manufacturers, including Customer 3, Customer 4, Customer 1, and Customer 2, and has successfully expanded its customer base to include overseas clients such as Intel (Dalian), Global Foundries, Unimicron Technology, and Texas Instruments. The funds raised in this offering, minus issuance expenses, will be invested in the following projects: Financially, in the years 2022, 2023, and 2024, Zhenbao Technology achieved operating revenues of approximately 386 million yuan, 506 million yuan, and 635 million yuan respectively; during the same period, net profits were approximately 81.62 million yuan, 108 million yuan, and 152 million yuan respectively.