Huatai (06886) will publicly issue the Technology Innovation Subordinated Bonds (First Tranche) in 2025 with a face interest rate of 1.71% for professional investors.

Huatai (06886) announced that, according to the "Announcement on the Public Issuance of Technology Innovation Subordinated Bonds (First Tranche) by Huatai Co., Ltd. for Professional Investors in 2025", the term of the Huatai Co., Ltd. 2025 Technology Innovation Subordinated Bonds (First Tranche) (referred to as "this bond") is 3 years, with a coupon rate range of 1.5% - 2.5%. The coupon rate of this bond is to be determined by the issuer and lead underwriter based on the results of the offline rate inquiry within the inquiry range. On May 9, 2025, the issuer and lead underwriter conducted a coupon rate inquiry with professional institutional investors offline. Based on the inquiries from professional institutional investors offline, and after consensus between the issuer and lead underwriter, the final coupon rate of this bond was determined to be 1.71%.