Qinghe Jingyuan Completes Pre-IPO Round Financing

Recently, semiconductor bonding integration company Qinghe Jingyuan announced the completion of its Pre-IPO round of financing. This round of financing was jointly invested by Weihao Chuangxin and fellow industry players Shanghai Xiangju Investment, Xiamen Jingyao, Xinlian Integration, Sichuan Development Science and Technology Innovation Fund, and other core semiconductor industry parties, as well as existing shareholders AMEC, Cowin Capital, Xindongneng, Yunhui Capital, Tsingke Fund of Funds, and Tsingke Industrial Investment. Qinghe Jingyuan's technology and products are widely used in cutting-edge fields such as HBM high-bandwidth memory, 2.5D/3D advanced packaging, sensing, optical communications, and wafer-level heterogeneous material integration.