HGTECH Strategic Placement Invests Nearly 200 Million Yuan in CanSemi

According to HGTECH news, today, CanSemi listed on the ChiNext board at an issue price of RMB 12.01 per share, with 30 investors participating in the strategic placement. HGTECH, as a strategic placement investor, contributed RMB 199 million. In addition to cooperation at the capital level, HGTECH has also signed a long-term strategic agreement with CanSemi to carry out comprehensive technical collaboration and industrial cooperation in cutting-edge fields such as wafer foundry for silicon photonic chips and optoelectronic supporting chips, packaging optics, and optoelectronic co-packaging.