Chipswill completed over 200 million yuan in D2 round financing.

On September 30, Chuangxin Huilian announced the completion of over 200 million yuan in D2 round financing. This round was led by Xingzheng Investment, with Deyang Jingkai Chuangyuan Fund, Changsha Chengfa Fund, and Chengdu Jinniu Jiaozi Fund participating, while existing shareholder Guangxi Guixin increased its investment. The financing funds from this round will be used for the large-scale shipment of multiple products such as satellite direct-connect chips and integrated space-ground terminal chips, as well as product iteration and preliminary research for 6G.