Huatai Securities (06886.HK): "25 Huatai Securities Sci-Tech Bond 01A" will pay interest on September 22.

Zhito Finance APP News, Huatai Securities (06886.HK) has issued an announcement. To ensure the smooth progress of interest payment for Huatai Securities Co., Ltd. 2025 Technology Innovation Bond (First Tranche) (Type One) (Bond abbreviation: 25 Huatai Securities Sci-Tech Bond 01A, Bond code: 342580006.IB), and to facilitate investors in timely receiving interest payment funds, the relevant matters are hereby announced as follows: Bond abbreviation: 25 Huatai Securities Sci-Tech Bond 01A, Total issue amount: RMB 300 million, Bond interest rate for this interest calculation period: 1.66%, Interest payment date: September 22, 2026.