Samsung Electro-Mechanics and Qualcomm reportedly partner to develop organic bridge technology

On September 14, it was reported that Samsung Electro-Mechanics is co-developing "organic bridge" technology with Qualcomm for advanced packaging of AI chips, and the two parties have been conducting R&D and validation work for more than a year. Samsung Electro-Mechanics is also developing 2.1D packaging substrates based on organic bridges in parallel with other customers. According to reports, Samsung Electro-Mechanics plans to embed organic bridges with 5 to 7 layers of redistribution layers into FC-BGA substrates, with the goal of reducing line width and line spacing to 1.5 to 2 micrometers. This technology is seen as a potential alternative to Intel's EMIB silicon bridge packaging technology.