According to TrendForce, the penetration rate of liquid cooling in AI chips is expected to rise to 53% in 2026 and approach 60% in 2027.

According to the latest AI Server industry research from TrendForce, amidst the wave of AI infrastructure construction, AI chips led by NVIDIA, AMD, and Google continue to iterate, with the thermal design power (TDP) of individual chips generally exceeding 1 kW. The power of cabinet-style AI Server solutions has risen to hundreds of kW, and liquid cooling is gradually becoming the standard configuration for high-end AI infrastructure. TrendForce estimates that by 2026, the penetration rate of liquid cooling in AI chips will reach 53%, and by 2027, it is expected to approach 60%.