Hua Qin Technology: Plans to apply for the registration and issuance of a technology innovation corporate bond not exceeding 1 billion yuan.

Huayin Technology announced that the company intends to apply to the Shanghai Stock Exchange for a public issuance of a total of no more than 1 billion yuan in corporate bonds for technological innovation. Upon approval, the bonds will be issued at an opportune time within two years according to actual funding needs, either as a single issuance or in installments. The term of the bonds will not exceed 5 years, and the raised funds will be used to repay interest-bearing debts and supplement working capital, among other purposes. The company's board of directors has submitted a proposal to the shareholders' meeting to authorize the management and responsible personnel to handle related matters. This authorization will be effective from the date of the shareholders' meeting's approval and will remain valid throughout the bond registration and duration period. This proposal has been approved by the board of directors and will be submitted for review at the second extraordinary shareholders' meeting in 2026.