Samsung Electronics plans to introduce 50 D2W Hybrid Bonders and expects to have them installed by the end of the year.

Samsung Electronics has selected Dutch semiconductor backend equipment company BESI as its primary partner and has started to introduce 50 D2W hybrid wire bonding machines. These equipment are expected to be installed on the production line at the Pyeongtaek Campus P5 factory by the end of this year, for the production of next-generation high-bandwidth memory and logic semiconductors.