Suiyuan Technology releases Cloud Sui ESL64-O super node.
Suoyuan Technology, in partnership with ZTE Communications, has released the Cloud Suio ESL64-O super node, which uses self-developed AI chips and achieves zero cable connection through OEX orthogonal backplane design, significantly reducing interconnection costs. In addition, Suoyuan Technology has also partnered with Xianfeng Technology to release advanced packaging samples of CoPoS panel for AI computing chips.
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