According to reports, TSMC is significantly expanding its PIC production capacity, with an expected monthly capacity of 25,000 pieces by 2028.

On July 8th, according to forecasts by institutions, TSMC's capacity for photonic integrated circuits will experience rapid growth. TSMC's capacity will increase from the current level of about 500 wafers per month to 10,000 wafers per month in the second quarter of 2026, further increasing to 15,000 wafers per month in the fourth quarter, and is expected to increase to at least 25,000 wafers per month by 2028. Institutions estimate that if each wafer contains 648 bare die, TSMC's monthly PIC production capacity will increase from 500 wafers to 10,000 wafers, resulting in an annual production output increase from about 4 million dies to 78 million dies. If the capacity further reaches 25,000 wafers per month, the annual PIC production output is expected to reach 194 million dies.