BOE Technology Group: has established a project team for Micro LED optical interconnection system and glass carrier plate CPO technology, accelerating technological breakthroughs.
On July 2, BOE Technology Group stated during institutional research that in terms of optical interconnects, the company's long-term accumulation of relevant technologies in the display industry, glass substrate processing capabilities, and large-scale intelligent manufacturing capabilities will effectively empower the company's research and development of optical interconnect technology and glass carrier plate CPO technology. Currently, the company has established a Micro LED optical interconnect system and glass carrier plate CPO technology research and development project team, and is conducting forward-looking technology research with ecosystem partners to accelerate technological breakthroughs.
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