Lates News

Applied Materials has publicly released a 3D chip manufacturing equipment product line aimed at AI semiconductor use. This series of equipment mainly focuses on the flatness, deposition, and metrology required for advanced packaging processes such as High Bandwidth Memory (HBM), Chiplets, and Hybrid Bonding. Specifically, the equipment released this time includes advanced Chemical Mechanical Polishing (CMP), Electrochemical Deposition (ECD), and Plasma-Enhanced Chemical Vapor Deposition (PECVD) equipment for the packaging field, as well as the addition of electron beam-based process control equipment and the upgrade of its epitaxial equipment for DRAM processes.