Zhongjin: High-end AI servers in the future are expected to adopt a composite cooling solution of "diamond heat sink + full liquid cooling".

The research report of Zhongjin Company believes that near-end heat dissipation and liquid cooling form a complementary system. Currently, the H100, Blackwell, and Rubin series GPUs continue to break through the kilowatt level in power consumption, with 3D packaging further increasing the local heat flow of the chip, and the thermal conductivity bottleneck of copper-aluminum materials is highlighted. Diamond has a super high thermal conductivity of 2000W/mK level and a low thermal expansion coefficient, which can quickly spread out the heat spots of the chip. At the industrial landing level, diamond is responsible for the near-end uniform heat diffusion of the chip, while liquid cooling is responsible for the system-level heat dissipation of the cabinet. The two are not mutually exclusive, and high-end AI servers in the future are expected to adopt a composite heat dissipation solution of "diamond heat sink + full liquid cooling".