Guo Mingqi: CoPoS is expected to start mass production in the second half of 2028, and glass and ABF are not interchangeable.

Analyst Guo Minghao wrote that Taiwan Semiconductor's next-generation advanced packaging technology CoPoS is expected to enter mass production in the second half of 2028. Research shows that glass materials will not replace ABF film, as the chip interconnection function is achieved through the wiring layers on the chip, glass vias/copper interconnect structures within the glass substrate, and layered ABF. Therefore, glass and ABF film are complementary and coexisting structures, rather than replacements.