Lates News

Analyst Guo Mingchi wrote that TSMC's next generation of advanced packaging technology, CoPoS, is expected to begin mass production in the second half of 2028. Research shows that glass material will not replace ABF thin film chip interconnection function, as the interconnect function of chips is focused on the wiring layer (RDL) on the chip side, glass via holes/copper interconnect structures within the glass substrate, and ABF layers working together. Therefore, glass and ABF thin film are complementary and do not have a replacement relationship.