Tongwei Group: Partial low-silver pulping solutions have been tested in small batches and introduced to specific product and customer demands.

Tongwei Corporation stated on the interactive platform that the company has always attached great importance to the research and development of low-silver and silver-free products, and has formed a diversified and hierarchical technological reserve covering both the paste end and the process technology end. In terms of paste end, the company has systematically developed and evaluated various metal pastes including silver-nickel paste, silver-plated copper, and copper paste for different technological routes, and conducted in-depth joint testing with leading paste suppliers. Currently, the application of silver-plated copper paste in HJT route is relatively mature, and has become a key breakthrough in cost reduction for this route, with the silver content rapidly decreasing. At the same time, the company also highly values the long-term reliability risks of such materials, prioritizing the quality stability of products throughout their life cycle in all testing and evaluation to ensure product reliability. The specific pace of mass production introduction will be determined based on a comprehensive dynamic evaluation of technological maturity, cost benefits, and most importantly, long-term reliability. Currently, some low-silver paste schemes have been tested and introduced in small batches for specific product and customer requirements.