Sifang Da: The diamond thermal pad has passed customer testing and entered the small-scale supply phase.

SiFangda stated at the 2025 performance briefing that the company is deeply cultivating the CVD diamond heat dissipation material track. The self-developed and mass-produced CVD diamond heat sink has a thermal conductivity of over 2000W, suitable for high-performance GPU, CPU, and other high-end electronic product heat dissipation scenarios. Currently, the company's diamond heat sink has passed customer testing, and the verification progress meets expectations, entering the small-scale supply stage. At the same time, the company is accelerating the construction of a CVD diamond heat dissipation base in Shayaya with an annual production capacity of 25,000 pieces to better match customers' needs for bulk and stable delivery, ensuring smooth order fulfillment.