Envux Electronics will showcase advanced silicon carbide chip embedded packaging technology at PCIM Europe 2026.

HanXu Electronics announced today that it has made a significant breakthrough in advanced power semiconductor packaging technology in the field of new generation power solutions. HanXu Electronics has successfully embedded silicon carbide grains in multi-layer ABF substrates, and innovatively adopted single-side copper exposed module packaging technology, allowing the industry standard power packaging body to integrate ceramic insulation substrates and wireless bonding processes. This innovative design brings significant technological breakthroughs to internal insulation power discrete devices, with the packaging body having electrical insulation capabilities while demonstrating the advantages of low parasitic inductance and extremely low conduction impedance at the same time. HanXu Electronics will participate in PCIM Europe 2026, which will be held in Nuremberg, Germany from June 9th to 11th, and showcase its latest chip embedded packaging technology, advanced power modules, and system integration solutions.