Huise New Materials: The company's photoelectric coating materials can be used in the glass substrate photoelectric packaging field.

Wisdom New Materials stated on the interactive platform that currently, the company's optoelectronic coating materials used in LED chip packaging can be applied in the field of glass substrate optoelectronic packaging. The company's related products have not yet formed a large-scale sales in this field, and the business carries uncertainty. Investors should be aware of the investment risks.