Eisen Co., Ltd.: Low-temperature PSPI receives customer orders, achieving domestic substitution of key materials in the semiconductor industry.

Recently, Eisen Corporation's self-developed low-temperature PSPI products have received orders from well-known customers in the industry, breaking the technological monopoly of foreign companies in low-temperature PSPI materials that has lasted for decades. This success has achieved another domestic substitution of key semiconductor materials. The company's low-temperature PSPI can be used as core insulation and dielectric materials, applied in fan-out wafer-level packaging, 2.5D/3D packaging, as RDL insulation layer, TSV sidewall passivation and filling, passivation layer in wafer-level packaging, buffer layer, and protective film. In the advanced packaging technology driving the development of AI chips, low-temperature PSPI plays a crucial role, but has long been monopolized by international giants.