Jintuo Corporation: Super-sized integrated circuit special reflow soldering equipment completes five generations of iterations, forming industry-leading thermal deformation research capabilities.

Jintuo Group stated in its investor relations activities that the company has completed five generations of iterations from project approval to the latest model of its ultra-large size integrated circuit special reflow soldering equipment project. The latest model of the equipment configuration can meet a wider range of production environments and product process requirements for soldering ultra-large size chips. In the process of developing this equipment, the company has collaborated with major customers and industry-leading companies to develop new thermal deformation testing equipment and testing methods, forming industry-leading research capabilities in large size soldering thermal deformation.