HuaFeng Technology has announced a strategic pivot to become a provider of end-to-end solutions, with the latest valuation exceeding $1 billion USD.

Sina Finance reported on March 30th that Huafeng Technology announced its 2.0 strategy in Shanghai, declaring a transition from a single advanced packaging equipment supplier to a provider of complete solutions. The company also launched the panel-level packaging equipment AvantGo L2, which can achieve two-micron precision within a range of 700*750 millimeters, supporting processes such as CoPos and EMIB. It was revealed that the delivery volume of AvantGo A2 has exceeded 20 units, with AvantGo A6 and its predecessor products totaling over 100 units delivered. According to Wang Hongbo, Chairman, Co-founder and CEO of Huafeng Technology, the company aims to achieve a 100% revenue growth by 2025 and expects to complete a 200% growth target by 2026. He disclosed that the company's latest valuation has exceeded $1 billion.