Samsung showcased next-generation AI chip HBM4E for the first time at Nvidia GTC conference.

At the GTC conference, Samsung Electronics showcased this chip for the first time, highlighting its efforts to become a key partner in NVIDIA's upcoming Vera Rubin platform. Samsung also demonstrated Hybrid Copper Bonding, a new packaging technology designed to overcome traditional thermocompression bonding physical limitations. HCB technology enables the new generation of high-bandwidth memory to achieve stacking of 16 layers or more, while reducing thermal resistance by over 20%. Other cutting-edge technologies developed for NVIDIA's AI infrastructure include HBM4 and SOCAMM2, both of which are currently in mass production.