Lates News

According to the latest high-speed interconnection market research by TrendForce, NVIDIA's next-generation AI computing cabinet architecture shows that the focus of future GPU designs will shift towards higher-density chip interconnection and faster data transmission. Chip interconnection within the cabinet (Scale-Up) and large-scale interconnection across cabinets (Scale-Out) will become the core issues in planning data centers. The traditional electrical transmission solution using copper cables is unable to meet the demands of ultra-large-scale data transfer due to physical limitations, leaving room for the development of optical transmission solutions. TrendForce estimates that the penetration rate of CPO in AI data center optical communication modules will grow year by year and could reach 35% by 2030.