Huaxincheng completes over 300 million yuan in Series A+ financing.

Recently, chip design service provider Huaxincheng Technology Co., Ltd. completed a new round of financing exceeding 300 million yuan. This round of financing was jointly invested by Pudong Venture Capital Group, Lingang Science and Technology Innovation Fund, and Shanghai Integrated Circuit Industry Fund. Established in 2021, Huaxincheng is committed to using artificial intelligence technology to create a full-process solution for chip design back-end to manufacturing EDA tools, providing advanced EDA products and IP services, and tackling the core cutting-edge technical challenges in chip process development. According to data, as of March 2026, the probability of financing for the following 2 years is 86.37%.