Shengmei Shanghai Obtains Advanced Packaging Equipment Orders from Multiple Global Customers.

According to the latest news from Shanghai, the company has secured advanced packaging equipment orders from leading semiconductor and technology companies worldwide. This order includes: multiple wafer-level advanced packaging electroplating equipment and wet processing equipment from a global leading semiconductor testing service company in Singapore, planned for delivery in the first quarter of 2026; a panel-level advanced packaging negative pressure cleaning equipment from a top semiconductor packaging manufacturer outside of mainland China, also planned for delivery in the first quarter of 2026; and multiple wafer-level advanced packaging wet processing equipment from a top technology company in North America, planned for delivery later this year.