Broadcom unveils industry's first 3.5D face-to-face computing SoC.

Broadcom announced today that it has begun shipping the industry's first 2nm custom compute SoC based on its 3.5D eXtreme Dimension System in Package platform. As a validated modular, multi-dimensional stacked chip platform, 3.5D XDSiP combines 2.5D technology with 3D-IC integration using face-to-face technology. Broadcom stated that 3.5D XDSiP is the foundation for the next generation XPU. With 3.5D XDSiP, consumer AI customers can provide the most advanced XPU with unparalleled signal density, outstanding energy efficiency, and low latency to meet the massive computing demands of gigawatt-scale AI clusters. Broadcom's XDSiP platform allows computing, memory, and network I/O to independently scale in a compact form factor, enabling efficient, low-power large-scale computing.